Since we have no dedicated hardware modding subforum I just went for the mod section - feel free to move the thread accordingly if I am in the wrong.
Recently I broke my OP3 and bought two used ones with shattered displays of ebay, assembling a frankenstein sort of phone with my working parts. Now I have two working OP3s, my daily driver and one with a shattered display. In addition, I have one that is almost completely ruined and useless. That got me thinking.
I recently saw a lot of manufacturers incorporating heat pipes made of copper, filled with a little liquid into their devices to spread the heat from the SoC more efficiently along the backside of the device. Namely the Razer Phone, The Galaxy S8 and S9, the new Pocophone F1, just to name a few. Naturally, these parts come available at replacement shops for cheap. Like here for example: https://stellatech.com/en/samsung-sm-g950f-galaxy-s8-heat-pipe,a,828202.html/
Now, since my OP3 tends to get hot in the SoC/Camera area not only during gaming, I thought why not try fitting one of these to the aluminum back of the phone. The OP3 appears to have some sort of thermally conducting sticker, connecting the SoC under its shield to the aluminum back for heat dissipation.
My plan would be to Dremel a groove into the aluminum back, to fit the heat pipe. Then secure it in place with thermally conducting glue, alternatively thermal paste and some drops of epoxy along the way. Remove the shield from the soc, cut the sides off for easier alignment and solder it to the heat pipe.
Then add some thermal paste to the CPU and GPU and press the back/heat pipe/shield assembly on, closing up the phone. Paste would have to be replaced every time the phone is opened though.
I am open to any suggestions how to better achieve this as well as educated guesses on the effectiveness of my project.
I
Or better
Replace the shield with thermal pad copper joined with the heatpipe
Apply liquid metal instead normal thermal paste
Make many tiny holes in the back case
Make a custom build cooler pad with 11000 RPM fans
Build by yourself or ask some kernel devs to put a very high frequencies in the custom setting
Put it on youtube with a clickbait title even it's not working
$ Profit $
150208 said:
Or better
Replace the shield with thermal pad copper joined with the heatpipe
Apply liquid metal instead normal thermal paste
Make many tiny holes in the back case
Make a custom build cooler pad with 11000 RPM fans
Build by yourself or ask some kernel devs to put a very high frequencies in the custom setting
Put it on youtube with a clickbait title even it's not working
$ Profit $
Click to expand...
Click to collapse
Someone give this guy a medal!!
Aluminium alone works also as a heat spreader. So I would maybe first try to polish the area on the case where the SoC is , to improve contact quality, and then use some higher quality thermal pad.
Run benchmarks before and after. (Like 10,x geekbench in a row.)
Heatpipes're used everywhere in tech these days. They work fine. I enjoy a snarky comment as much as the next droider, but really there's no reason you couldn't mod a case back to have a heatpipe running all the way down, although it might heat up the battery running past it.
Alternative
or you can try using this instead just copy paste on Amazon
Innovation Cooling Graphite Thermal Pad – Alternative To Thermal Paste/Grease (30 X 30mm)
for us, the PC enthusiasts its been working legit wonders while not having the downsides of paste
I think it would be unnecessary for already cooled device
Related
Hey guys, I have read many reviews where people complain about overheating and excessive amount of heat from the phone localized in one area. Based on the tear down provided by ifixit, there looks to be no EMI shield over the CPU/memory chip area unless it was removed before the photo was taken. But either way, I see that when assembled there is the metal backing to the LCD directly above it which would really dissipate the heat well.
Why not purchase some thin thermal pads and apply as necessary to transfer the heat to the metal frame directly above it. Even if there is an EMI shield over it, open it up (unless it's soldered making it harder) and put the thin thermal pad in there and on the outside of the shield.
Seems like a very simple solution to fix a pretty big problem. I don't have my hands on a Nexus 4 and am unsure if I will in the future but if I ever do I will definitely try this and provide results and instructions on how to do the same.
Or LG could design the phone better.
johnny13oi said:
Hey guys, I have read many reviews where people complain about overheating and excessive amount of heat from the phone localized in one area. Based on the tear down provided by ifixit, there looks to be no EMI shield over the CPU/memory chip area unless it was removed before the photo was taken. But either way, I see that when assembled there is the metal backing to the LCD directly above it which would really dissipate the heat well.
Why not purchase some thin thermal pads and apply as necessary to transfer the heat to the metal frame directly above it. Even if there is an EMI shield over it, open it up (unless it's soldered making it harder) and put the thin thermal pad in there and on the outside of the shield.
Seems like a very simple solution to fix a pretty big problem. I don't have my hands on a Nexus 4 and am unsure if I will in the future but if I ever do I will definitely try this and provide results and instructions on how to do the same.
Click to expand...
Click to collapse
Is not a bad idea actually, but i'm not too sure if the display will soffer about it
If only had a n4 to test it XD (i have some thermal pad lying around)
Venekor said:
Or LG could design the phone better.
Click to expand...
Click to collapse
This.
Sent from my Nexus 4 using Tapatalk 2
InvalidUsername said:
Venekor said:
Or LG could design the phone better.
Click to expand...
Click to collapse
This.
Sent from my Nexus 4 using Tapatalk 2
Click to expand...
Click to collapse
We hack phones to try and make them work better on this website, did you know that?
Venekor said:
Or LG could design the phone better.
Click to expand...
Click to collapse
While I agree with you, thermal pads are relatively cheap and the concerns about pressure on the LCD by another poster would be fine as long as you use a thinner thermal pad that doesn't compress too much after application. I have various thickness of thermal pads so as long as you use the correct one to apply just the right amount of pressure I can only see a large benefit from something so simple.
It would require opening the device and I am unsure if there are warranty voiding stickers in the phone. Some people are really happy with the phone and this is the only problem so I am merely just trying to provide a solution to the one problem remaining.
Thermal pads are to conduct heat from one surface (CPU) to another (heatsink). I can't say I agree with using the screen as a heatsink.
johnny13oi said:
While I agree with you, thermal pads are relatively cheap and the concerns about pressure on the LCD by another poster would be fine as long as you use a thinner thermal pad that doesn't compress too much after application. I have various thickness of thermal pads so as long as you use the correct one to apply just the right amount of pressure I can only see a large benefit from something so simple.
It would require opening the device and I am unsure if there are warranty voiding stickers in the phone. Some people are really happy with the phone and this is the only problem so I am merely just trying to provide a solution to the one problem remaining.
Click to expand...
Click to collapse
I wasn't talking of the pressure but the heat that the backplade dissipate, maybe can damage the screen
I doubt it will help,
someone pointed out that the only trigger for thermal throttling is the battery temperature,
http://forum.xda-developers.com/showpost.php?p=34224171&postcount=85
BakaPhoenix said:
I wasn't talking of the pressure but the heat that the backplade dissipate, maybe can damage the screen
Click to expand...
Click to collapse
Yeah, i would guess the space there is to keep the heat from the screen...
If this phone runs hot it is most likely due to the glass acting as an insulator. Is there any venting anywhere? I bet much of the thermal issue could be solved with a well placed vent..
sent via xda premium with nexus 7-Xbox live-loneleppard add me
While I can see concerns about damaging the LCD due to the heat but I imagine heat spread over the entire surface of the phone is much better than localizing a much more intense heat in a smaller area. LCDs can withstand a decent amount of heat and a small arm chip spreading heat over the entire surface of the phone would be very minimal to no effect on the LCD. I can see great potential for damage allowing the heat to be confined to a small area (just the CPU and RAM sitting on each other) with no heat spreader or heat sink.
Well I guess we won't be overclocking this phone anytime time soon. And you know I was really hoping I could finally fry me some bacon strips on my way to work.
johnny13oi said:
While I can see concerns about damaging the LCD due to the heat but I imagine heat spread over the entire surface of the phone is much better than localizing a much more intense heat in a smaller area. LCDs can withstand a decent amount of heat and a small arm chip spreading heat over the entire surface of the phone would be very minimal to no effect on the LCD. I can see great potential for damage allowing the heat to be confined to a small area (just the CPU and RAM sitting on each other) with no heat spreader or heat sink.
Click to expand...
Click to collapse
Air is a very good thermal isolator, i read that many desktop ips lcs have a maximum teamp. of 35/40 C° so if if the cpu heats a lot it can create problems. I don't know how much is the max temp that this ips can withstand tough.
BakaPhoenix said:
Air is a very good thermal isolator, i read that many desktop ips lcs have a maximum teamp. of 35/40 C° so if if the cpu heats a lot it can create problems. I don't know how much is the max temp that this ips can withstand tough.
Click to expand...
Click to collapse
I really think this whole heat thing is a kernel issue at the moment. I remember owning the one x since very 1.26 or was it an earlier one? Either way, the phone would really get VERY hot. After a few updates i barely felt the heat. Maybe when playing games or whatever, all in all the updates solved the issue. I think google will manage to sort it out, i can't imagine them being that stupid.
I guess if you are concerned with the LCD becoming damaged then you could just put the thermal pad on the other side to make the whole motherboard (minus spring contacts) contact the glass back and spread the heat outside including the battery.
And yes air is a very good thermal insulator so all the heat is just getting trapped inside the phone. Gotta use some thermal pads to conduct that heat to a panel exposed to the outside.
These are all just suggestions that I would do if I were to have one in my hands right now.
johnny13oi said:
I guess if you are concerned with the LCD becoming damaged then you could just put the thermal pad on the other side to make the whole motherboard (minus spring contacts) contact the glass back and spread the heat outside including the battery.
And yes air is a very good thermal insulator so all the heat is just getting trapped inside the phone. Gotta use some thermal pads to conduct that heat to a panel exposed to the outside.
These are all just suggestions that I would do if I were to have one in my hands right now.
Click to expand...
Click to collapse
The bottom line is if the SOC or N4 design is flawed internally which created thermal throttling, then there won't be much help for inserting thermal pads. I have tried this with HD2 when it had thermal runaway. There was a huge thread figuring out how to cure it by many methods as far as putting the motherboard in the oven to melt the soldering at exact time and temperature. The thermal pads method only decreased a few Fahrenheit which wasn't enough to cure if there was a thermal problems. My HD2's SOC was made by Qualcomm. Something definitely don't add up with bad benchmarks scores, thermal problems. Could future updates cure this? Only time can tell.
I've done something similar with my OCed Samsung i9000, but instead of using thermal pads, I used thermal paste. Similar to the Nexus 4 the cpu IC is sandwiched between the PCB and the metal chassis. The metal chassis becomes a massive heatsink for the CPU which dropped my CPU temp. by 10oC (~17oF) at maximum load.
After 9 months of use there hasn't been any damage or deterioration of the display screen (AMOLED).
Details can be found in the i9000 forum.
http://forum.xda-developers.com/showthread.php?t=1605517
When I receive my Nexus 4 I plan to do something similar.
The only problem i can see with this method is warranty. I'm 100% sure that even if there is no warranty void stickers on the screws they won't accept to fix a phone that has been tinkered with
And try to wipe thermal paste without leaving any trace you will fail
Capt.PP said:
The bottom line is if the SOC or N4 design is flawed internally which created thermal throttling, then there won't be much help for inserting thermal pads.
Click to expand...
Click to collapse
It is not flawed as such, it is just overdimensioned.
In essence it is a double APQ8060A + quicker (more power hungry) GPU + additional management circuitry. So it should not surprise, that under full load (benchmarks) it burns through more than double of the usual dual core Krait phone power. While having similar dimensions/power dissipation capacity.
In their marketing Qualcomm positioned this SoC for Tablets. Now you have it in the phone. Is it bad? Not really, full power quadcore tasks is not a realistic task for a phone. And for a second or two (after this it does not matter anymore since your phone "lags") the existing cooling is perfectly adequate.
One thing where Qualcomm/LG/Google could do better are the GPU drivers. Which currently seem badly tuned.
Lg g4 thermal paste mod
This is my guide for applying thermal paste or pads to various parts of g4 to help disapate heat better.
i personally use Arctic silver About 12 dollars american at any radioshack.
1st of all I am not holding a gun to your head, Im not forcing anyone against there will if you are not comfortable tearing down your phone,
dont!!!!!!
In recent events of loads of g4s bootlooping.
I want to say i have a 10/15 g4 hardware rev 1.1 have had it nearly a year and so far no loop.
Prob wishful thinking but I want to say this may be why helps get rid of the heat off the old girl.
3 screens later, 2 camera lenes, and a leather back. still rooted on zv6 So up yours LG.
So lets get started
1st remove back cover and in my case i have a cell phone repair kit with the screw drivers and prys. Remove all the screws in the frame assambly. There are 11 of them.
2nd carefully pry the rear frame apart from the screen assambly.there are no wires to disconect yet. Do not force her apart she will come apart when all the clips are released.
3rd once the backplate is free there are 3 wire clips 1 on the camera one next to it for the light sensors and down near the bottom rite under the battery.
4th you can leave the camera module in just move the three wires slightly to the side and carefully remove the board flip it over and again carefully pry the big tin away from the board.
5th im a little eccentric so i applied the paste to all 5 chips underneith the tin just a very small dab goes a long way see in pics attached
6th when putting the tin back on make sure its lined up on all points.
this is also a common ground connector on most phones.
From here just reassmble and enjoy!!!!
Whole procsess took about 20 min
Before I started I was at 45 Celsius now after moderate usage to check temp 29 celsius.
Ive run the piss out of this phone. sold it twice and got it back wireless charge.
Shes a soldier.
To see what each circuit is, see step 8 here:
https://www.ifixit.com/Teardown/LG+G4+Teardown/42705
Rear-facing chips:
Avago ACPM-7717 Multiband Multimode Power Amplifier
Qualcomm WCD9330 Audio Codec
SlimPort ANX7816 Ultra-HD Transmitter
Qualcomm PM8994 Power Management IC
NXP 47883 NFC Controller
Samsung K3QF6F60AM-QGCF 3 GB LPDDR3 RAM
The Hexa-Core, 1.8 GHz Qualcomm Snapdragon 808 SOC is layered beneath the RAM.
Toshiba THGBMFG8C4LBAIR 32 GB NAND Flash
Broadcom BCM4339HKUBG 5G WiFi Client
Qualcomm PMI8994 Power Management IC
IDT P9025A Qi Wireless Power Receiver IC
Qualcomm WTR3925 LTE Transceiver
---------- Post added at 11:20 AM ---------- Previous post was at 11:14 AM ----------
TheMadScientist420 said:
I place a ever so slight smudge of arctic silver on all 6 plus the larger black chip and so
Click to expand...
Click to collapse
Can you clarify - did you put the thermal past *only* between those chips in your picture, and the little metal cover that goes over them? I can't tell if you also put it between the metal covers and the frame of the phone?
Yea i did a small smudge on each then i put the cover back on arctic silver is a pretty nonconductive paste i try not to put it on everything all sloppy but ive never had it liqufy and run any where either some people say it does i didnt put none on the frame or cover.
Im not familiar with this layoit either knowin my dumb arse i put it on the wrong chips but i went through my g3 and actually done a bunch of them in small doses of coarse throught the whole board
Kingfattys diagram is rite i couldnt find a diaram of the board so im partially wrong. I will update tonight ill do another tear down and take more pics
The proscessor is on the backside. Thats why i ask for help to im goin off a old setup.
Ofcoarse it never hurts to coat more chips all produce heat. Ill label the diagrams and do a complete guide rework tonight on my computer
figured id brink this back up on the thread list
so
Bump
dont know if its helped guys.
but so everyone knows i havnt had a bootloop issue on my g4 yet to date again knock on lgs synthetic leather.
there has been a lot of discussions of heat being the primary cause for the failed solder joints and maybe this helped maybe it didnt
What kind of temps are you getting when running antutu on tz_sensor13/14?
tbob18 said:
What kind of temps are you getting when running antutu on tz_sensor13/14?
Click to expand...
Click to collapse
Let me dl ot and run it i use 3c toolbox and max is usaually 45. Ive seen 55 or 60 but highly rare. I was using vr and charging together lol
Im runnin the test now
tbob18 said:
What kind of temps are you getting when running antutu on tz_sensor13/14?
Click to expand...
Click to collapse
Here they are
TheMadScientist420 said:
Here they are
Click to expand...
Click to collapse
That's quite good. How long was that running?
tbob18 said:
That's quite good. How long was that running?
Click to expand...
Click to collapse
7 or 8 min
TheMadScientist420 said:
7 or 8 min
Click to expand...
Click to collapse
Using the stress test? Wow, I'm definitely going to add thermal paste. That's a good 15-20c lower than mine.
tbob18 said:
Using the stress test? Wow, I'm definitely going to add thermal paste. That's a good 15-20c lower than mine.
Click to expand...
Click to collapse
now if u look i pasted almost every flat chip on the front and back under the tins and everything i paste everything from my phones tablets ps3 ps4 pc even the heat sinks on my stereo
and i seem to have decent luck with my electronics so far.
ive replaced the screen on my g4 3 times now sold it 2 or 3 times and bought it back people loved it so much they went out and got g5s and v20s
dissambly is very easy straight foward other than no twrp and keep busting screen i love my g4
i just always keep a back up device just in case. of coarse i have one of the older ones so im stil on zv6 and rooted to the gills
tbob18 said:
Using the stress test? Wow, I'm definitely going to add thermal paste. That's a good 15-20c lower than mine.
Click to expand...
Click to collapse
just noticed your from chi town
born and raised in Gary IN moved to tn when i turned 18 now im in vermont the mountains of green state lol
TheMadScientist420 said:
now if u look i pasted almost every flat chip on the front and back under the tins and everything i paste everything from my phones tablets ps3 ps4 pc even the heat sinks on my stereo
and i seem to have decent luck with my electronics so far.
ive replaced the screen on my g4 3 times now sold it 2 or 3 times and bought it back people loved it so much they went out and got g5s and v20s
dissambly is very easy straight foward other than no twrp and keep busting screen i love my g4
i just always keep a back up device just in case. of coarse i have one of the older ones so im stil on zv6 and rooted to the gills
Click to expand...
Click to collapse
Yeah, I really like how the G4 feels and the camera is nice. But temps are crazy. LG seems to have really failed on that front, not to mention how it's all locked down now.
My G2 has been great for that last 3 and a half years, replaced the screen 3 times, battery is now failing though. I'll prob grab another screen as it's just a great, reliable device.
TheMadScientist420 said:
just noticed your from chi town
born and raised in Gary IN moved to tn when i turned 18 now im in vermont the mountains of green state lol
Click to expand...
Click to collapse
Nice, I head over to the Indiana dunes area a lot in the summer, some nice places over there. :good:[
--
What do you get in antutu btw?
tbob18 said:
Yeah, I really like how the G4 feels and the camera is nice. But temps are crazy. LG seems to have really failed on that front, not to mention how it's all locked down now.
My G2 has been great for that last 3 and a half years, replaced the screen 3 times, battery is now failing though. I'll prob grab another screen as it's just a great, reliable device.
Nice, I head over to the Indiana dunes area a lot in the summer, some nice places over there. :good:[
--
What do you get in antutu btw?
Click to expand...
Click to collapse
id have to run it again didnt even pay attantion
mines loaded with loads of crap on it im sure it was pretty low
ive never been one to really go off benchmark scores just numbers to me like ive got a old one loaded up youve got a new one probly still fairly clean
im more into actual real life usage fluidity
i know mine has no lag doesnt overheat and is still fairly smooth running
still handles the gear vr pretty damn good
TheMadScientist420 said:
id have to run it again didnt even pay attantion
mines loaded with loads of crap on it im sure it was pretty low
ive never been one to really go off benchmark scores just numbers to me like ive got a old one loaded up youve got a new one probly still fairly clean
im more into actual real life usage fluidity
i know mine has no lag doesnt overheat and is still fairly smooth running
still handles the gear vr pretty damn good
Click to expand...
Click to collapse
Yeah, I'm not one for benchmarks either, but it can give an idea of the health of the hardware. I did notice lower scores on some G4's I think it may be because of throttling due to overheating though. I get around 70,000, if I put a little pc fan next to it, it gets 71,500.
Copper Heat Sink is the way to go
Copper Heat Sink works the best. There is a video on Youtube, just search youtu.be/G3dQdS1b0aw
CellphonePro said:
Copper Heat Sink works the best. There is a video on Youtube, just search youtu.be/G3dQdS1b0aw
Click to expand...
Click to collapse
Nice video. Summary of procedure:
1) open the phone to reveal the circuit board
2) remove the large metal shroud or plate covering the processor chip and memory chips
3) cut out and remove a section of the large metal shroud that would normally cover the processor chip
3) get a piece of "heatsink tape" (e.g., thermal tape, he uses a tape with copper on top and adhesive on the bottom) and cut it to fit on the top of the memory chip, apply it to the memory chip
4) replace the large metal shroud over the chip - this covers and sandwiches the thermal tape on the memory chip under the shroud, while exposing the processor chip due to the hole you cut in step 3) above
5) apply another section of large thermal tape over the exposed processor to extend beyond the processor to the sides, covering over the metal shroud too (*this I disagree with, see below*)
6) apply a small section of thermal tape over the metal shroud located where the memory chip is located
Disagreement issue: there is a gap/divot over the processor, which will no longer make stiff contact with the frame when you assemble the phone. You can see the divot around 13:00 of the video, how the thermal tape "dips" in over the processor.
To fix, I'd add step between 4 and 5:
4.5) apply a small section of thermal tape directly over the naked processor to serve as a shim - just copy step 3) by applying the same procedure to the processor, not just the memory chip
By giving the processor the same covering of thermal tape as you did the memory chip, you will make sure the tape from step 5) that lays across the metal shroud and processor, will now be flat and not have a divot, to ensure good pressure/contact between the frame and the processor when you install the frame
Hi,
As I have to rebuild my z3+ anyway, due to screen/frame replacement, I would like to make sure that I create the best thermal sink possible between the CPU and the metal frame (to anyone else who is replacing the frame of their z3+/z4, watch out for the undersized copper heatsink/heatpipe on non-original metal backpanes. Use the original metal plate even if swapping out the frame).
Of course, whenever we tear down the phone and rebuild, we need to make sure to discard the original thermal pad and replace it. But what is the best replacement? As we can't be sure that the cpu is pressed firmly against the copper pad/pipe on the metal backpane, I have assumed that a silicone pad is the best option, but maybe this is not true. Can anyone recommend other options (thermal paste? /sims + paste?). What products have others used?
BR.
Learnincurve said:
Hi,
As I have to rebuild my z3+ anyway, due to screen/frame replacement, I would like to make sure that I create the best thermal sink possible between the CPU and the metal frame (to anyone else who is replacing the frame of their z3+/z4, watch out for the undersized copper heatsink/heatpipe on non-original metal backpanes. Use the original metal plate even if swapping out the frame).
Of course, whenever we tear down the phone and rebuild, we need to make sure to discard the original thermal pad and replace it. But what is the best replacement? As we can't be sure that the cpu is pressed firmly against the copper pad/pipe on the metal backpane, I have assumed that a silicone pad is the best option, but maybe this is not true. Can anyone recommend other options (thermal paste? /sims + paste?). What products have others used?
BR.
Click to expand...
Click to collapse
This might be of help
http://forum.xda-developers.com/nexus-6p/general/guide-improve-cooling-greatly-reduce-t3323898
Hello everyone, thanks for checking out my thread :good:
As you all know, our beloved Xperia Z4 tend to heat up when doing some "intensive" work. Sure, I can live with the phone closing YouTube when it gets too hot, but the Camera app closes after taking a Full HD video for two minutes. It's quite frustrating, especially when recording a concert. That's two minutes of video and 6 minutes of cooldown.
On the other side, I just replaced my rear camera after it died from a drop. The technician glued the back cover, but I noticed that the glue was a mess and the back cover wasn't aligned properly, causing the left side of the panel to sink in. I asked other technicians if they can redo the job. However, they said maybe and no, because the back cover might crack, due to the left side sinked in.
Now, since the SoC heats up easily, and the back cover might get cracked, I waa thinking of designing a back cover made of aluminium. Basically it will act as a heatsink for the SoC while also acting as a normal back cover.
I already considered a few problems that might happen, like removing the back cover (since I believe anodized aluminium will be slippery) or making custom lenses and rubber rings for the camera and flash LED, but I wanted to know, what do you guys think? Is it a good idea?
I have bought an aluminium back cover from Aliexpress but could not test it to change of season (winter) during long delivery time.
Presently I am using a hard thick plastic back cover which stops heat reaching mu fingers and major heat dissipation is through screen only. Since I don't feel heat so I am not much worried. My phone is rooted and I am using thermal xposed module which keeps everything working in all seasons (phone has to die one day anyway).
I sometimes think of using thermal paste between the chip and phone's glass back cover but never tried it.
waseemakhtar said:
I have bought an aluminium back cover from Aliexpress but could not test it to change of season (winter) during long delivery time.
Presently I am using a hard thick plastic back cover which stops heat reaching mu fingers and major heat dissipation is through screen only. Since I don't feel heat so I am not much worried. My phone is rooted and I am using thermal xposed module which keeps everything working in all seasons (phone has to die one day anyway).
I sometimes think of using thermal paste between the chip and phone's glass back cover but never tried it.
Click to expand...
Click to collapse
Late answer, but I am going to try adding extra cooling on the Z4 by adding a custom copper sheet inside with some thermal paste and replacing the thermal pad on the screen side.
Hi I just want to share my experience about the replacement of the thermal paste because I didnt find any thread speaking about it here. In some devices with the same SoC I read than it works perfect.
Each phone and each user are really different, but the time pass and now we have a >4 year phone with passive heat dissipation (chassis) and with a thermal paste that could be dry.
In my particular case, I just changed it and now when the QC 3.0 is activated to charge the battery, looks is not even hot, also when I use it meanwhile. (I used an low quality one, but next week I will try with MX-4)
Did you do it?
Which thermal paste you use?
What is your experience?
Note: When I applied the thermal pate I removed a whit compound sticked between the thermal pad and the SoC, and cleaned the surfaces of chassis and SoC with alcohol before application.